“The RF front end device market is being driven by three key dynamics: higher levels of functionality, high unit volume growth and constant pricing pressures. The PAx has been developed to meet the challenges caused by these dynamics”

LTX-Credence’s new test system has been specifically developed to address the high volume manufacturing test challenges of suppliers of advanced front end RF devices such as Multiband RF Power Amplifiers, RF Front End Modules, RF Analog System in Package and RF discrete devices. Leveraging the X-Series XRF test instrumentation, the PAx enables cost effective, high-volume performance testing of advanced front end RF devices used in applications utilizing WLAN, WiMAX, GSM, Edge CDMA, WCDMA, LTE, Bluetooth or other RF signaling standards.

"The RF front end device market is being driven by three key dynamics: higher levels of functionality, high unit volume growth and constant pricing pressures. The PAx has been developed to meet the challenges caused by these dynamics," commented John Shelley, product director, LTX-Credence. "We are excited that Unisem’s Sunnyvale test development center has chosen the PAx platform to serve as the tester of choice for this market segment.”

"The addition of the PAx test system from LTX-Credence is another example of Unisem’s continued commitment to positioning Unisem Sunnyvale at the forefront of the group’s test equipment roadmap,” said Marita Erickson, general manager, Unisem-Sunnyvale. "Sunnyvale serves as a development center where we work hand in hand with customers to create the optimum test solutions, get them production ready, and when appropriate, move them to our high volume factories in Asia."

About LTX-Credence

LTX-Credence is a global provider of ATE solutions designed to deliver value through innovation enabling customers to implement best-in-class test strategies to maximize their profitability. LTX-Credence addresses the broad, divergent test requirements of the wireless, computing, automotive and entertainment market segments, offering a comprehensive portfolio of technologies, the largest installed base in the Asia-Pacific region, and a global network of strategically deployed applications and support resources. Additional information can be found at www.ltxc.com.

About Unisem

Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. With approximately 10,000 employees worldwide, Unisem has factory locations in Ipoh, Malaysia; Wales, United Kingdom; Chengdu, People’s Republic of China; Batam, Indonesia and Sunnyvale, USA. The company is headquartered in Kuala Lumpur, Malaysia. For more information about the company, its products and services, please visit its website at www.unisemgroup.com.